Where Solid-State Micro-Cooling Fits in Data Centers
Data Center Knowledge, Wednesday, October 28th, 2026
xMEMS solid-state micro-cooling chips target hotspots in data center components like SSDs that cold plates and fans miss.
Data Center Knowledge examines solid-state micro-cooling, in which xMEMS uCooling chips use a piezoMEMS platform to generate directed airflow without a rotating fan.
Its XMC-2400 and XMC-4800 chips deliver small, high-pressure airflows at 150 to 240 mW and are meant to be built into subsystems such as enterprise SSDs and laser modules.
The clearest use case is SSDs, where a cold plate on one side can leave NAND on the other side hot enough to throttle.
The technology complements rather than replaces server cooling, and xMEMS' Mike Housholder suggests liquid micro-channels may be needed for mainstream processors.